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6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

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6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

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Brand Name : Bicheng

Model Number : BIC-052.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Rogers' RO4350B

Layer count : 6-layer

PCB thickness : 1.6mm

PCB size : 110mm × 80mm ±0.15mm

Copper weight : 1oz (1.4 mils) for both inner and outer layers

Surface finish : Electroless Nickel Immersion Gold (ENIG)

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This is a 6-layer high-performance PCB constructed with Rogers RO4350B laminate, a woven glass-reinforced hydrocarbon/ceramic composite engineered for high-frequency applications. The PCB integrates advanced material properties with precision manufacturing to deliver exceptional electrical performance, structural stability, and cost-effectiveness for RF and microwave systems.

PCB Specifications

Parameter Technical Details Engineering Significance
Base Material Rogers RO4350B (woven glass reinforced hydrocarbon/ceramic composite) Combines PTFE-like electrical performance with epoxy/glass manufacturability, ideal for high-frequency applications
Layer Count 6-layer rigid configuration Supports complex signal routing with dedicated power/ground planes for EMI control
Board Dimensions 110mm × 80mm ±0.15mm Ensures dimensional stability for automated assembly and enclosure fitting
Minimum Trace/Space 4/4 mils Enables high-density routing with minimal crosstalk in RF circuits
Minimum Hole Size 0.3mm Accommodates fine-pitch components while maintaining structural integrity
Vias 455 total; blind vias (L1-L4, L5-L6); 20μm plating thickness Reduces signal path length and minimizes reflections in high-speed designs
Finished Thickness 1.6mm Provides optimal balance between structural rigidity and weight
Copper Weight 1oz (35μm) for inner and outer layers Ensures low resistance while maintaining high-frequency performance
Surface Finish Electroless Nickel Immersion Gold (ENIG) Delivers excellent corrosion resistance, solderability, and stable RF contact resistance
Silkscreen White on both top and bottom layers Facilitates component identification and assembly verification
Solder Mask Green on both top and bottom layers Protects copper traces while providing environmental resistance
Quality Assurance 100% electrical testing (continuity, isolation, and impedance) Verifies compliance with design specifications prior to deployment

Stack-up Configuration

The 6-layer stack-up is engineered for optimal signal integrity and controlled impedance:

Layer Sequence Material/Component Thickness Function
1 Copper Layer 1 35μm Primary signal layer for high-frequency traces
2 Rogers RO4350B Core 0.254mm (10mil) Dielectric layer with controlled Dk for impedance management
3 Copper Layer 2 35μm Ground plane for Layer 1 signals
4 Prepreg RO4450F (x2) 0.2mm Bonding layer with compatible dielectric properties
5 Copper Layer 3 35μm Power distribution layer
6 Rogers RO4350B Core 0.508mm (20mil) Central dielectric providing isolation between planes
7 Copper Layer 4 35μm Secondary ground plane
8 Prepreg RO4450F (x2) 0.2mm Intermediate bonding layer
9 Copper Layer 5 35μm Secondary signal layer
10 Rogers RO4350B Core 0.254mm (10mil) Bottom dielectric layer
11 Copper Layer 6 35μm Auxiliary signal routing layer

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

RO4350B Material Properties

Rogers RO4350B laminate exhibits key characteristics that enhance PCB performance:

Property Value Technical Impact
Dielectric Constant (Dk) 3.48 ±0.05 @ 10GHz/23°C Ensures consistent signal propagation with minimal variation
Dissipation Factor (Df) 0.0037 @ 10GHz/23°C Minimizes signal loss in high-frequency applications
Thermal Conductivity 0.69 W/m/°K Facilitates efficient heat dissipation from active components
CTE (X/Y/Z) 10/12/32 ppm/°C Matches copper expansion to reduce thermal stress and via fatigue
Glass Transition Temperature (Tg) >280°C Maintains stability during high-temperature processing and operation
Water Absorption 0.06% Prevents performance degradation in humid environments
Flammability Rating UL 94 V-0 Enables use in applications requiring fire safety compliance

Manufacturing and Quality

Artwork Format: Gerber RS-274-X, ensuring compatibility with standard PCB fabrication processes

Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for general electronics applications

Processing Compatibility: Compatible with standard FR-4 manufacturing workflows, eliminating the need for specialized processing required by PTFE-based materials

Application-Specific Advantages

The PCB's design and material selection make it particularly suitable for:

Cellular Base Stations: Low dielectric loss ensures efficient signal transmission in power amplifiers and antenna systems

Automotive Radar: Dimensional stability and thermal performance withstand harsh automotive environments

RF Identification Systems: Controlled impedance characteristics support reliable wireless communication

Satellite LNBs: Tight Dk tolerance enables precise phase matching in frequency conversion circuits

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

Availability

This PCB is available for worldwide shipping, supporting global project requirements.

Conclusion

This 6-layer RO4350B PCB combines advanced material properties with optimized stack-up construction to deliver exceptional performance in high-frequency applications. Its balance of electrical performance, manufacturability, and cost-effectiveness makes it an ideal solution for demanding RF and microwave systems.

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications


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