This 2-layer Rogers CuClad 250 rigid PCB is a high-performance microwave circuit board engineered for low-loss RF and high-frequency microwave applications. Built on premium Rogers CuClad 250 cross-plied PTFE fiberglass composite substrate, this rigid PCB features a 0.4mm finished board thickness, high-quality immersion gold surface finish, and 1oz outer copper layers. Every unit undergoes 100% electrical testing before delivery and complies fully with strict IPC-Class-2 quality standards. Delivering balanced mechanical stability, consistent dielectric performance, and minimal high-frequency signal loss, this PCB serves radar systems, microwave component modules, and various RF-sensitive circuits. We accept global Gerber RS-274-X file submissions for custom quotation and support worldwide shipping.
What Is Rogers CuClad 250? Substrate Overview
Rogers CuClad 250 series laminates are professional cross-plied woven fiberglass reinforced PTFE composite materials, specifically engineered for high-frequency microwave circuit fabrication. Featuring a unique alternating 90° cross-plied structural design and optimized fiberglass-to-PTFE ratio, this substrate delivers mechanical performance close to traditional rigid PCB materials while retaining the low-loss electrical advantages of PTFE dielectric.
Compared with ordinary non-woven fiberglass substrates, CuClad 250 achieves superior dimensional stability and uniform thermal expansion across all directions. Its tightly controlled dielectric constant and low dissipation factor effectively reduce high-frequency signal attenuation and parameter deviation, ensuring stable and repeatable circuit performance for precision microwave and RF equipment.
Core Performance Features of Rogers CuClad 250 PCB
Boasting well-balanced electrical stability, mechanical durability, and environmental adaptability, CuClad 250 laminates meet rigorous industrial standards for high-frequency microwave circuit operation:
Stable Dielectric Constant (Dk): Maintains a consistent DK value ranging from 2.40 to 2.55 at 10GHz / 1MHz, supporting precise circuit impedance design
Low Dissipation Factor (Df): Features a low loss tangent of 0.0017 at 10GHz, effectively minimizing high-frequency insertion loss and signal attenuation
Minimal Moisture Absorption: Ultra-low moisture absorption rate of 0.03%, preventing electrical performance shifts caused by humid environments
High Copper Peel Strength: Delivers robust bonding strength of 14 lbs/in between copper foil and substrate, ensuring long-term structural reliability
Ultra-Low Outgassing Performance: Achieves extremely low total mass loss (TML 0.01%), zero collected volatile condensable material (CVCM 0.0%), and no water vapor regain, ideal for high-precision and vacuum environment applications
Optimized Structural Design: Adopts cross-plied woven fiberglass with alternating 90° oriented plies and a high PTFE-to-glass ratio for balanced mechanical and electrical properties
Key Benefits of Rogers CuClad 250 PCB
Tailored for high-frequency microwave and precision RF circuit needs, Rogers CuClad 250 substrates offer comprehensive performance advantages that outperform conventional high-frequency materials:
Balanced Dual Performance: Unique cross-plied structure harmonizes electrical uniformity and mechanical stability, avoiding unbalanced parameter deviation in single-direction substrates
Lower Insertion Loss: Moderate low Dk value allows wider line width design options, further reducing high-frequency signal transmission loss
Superior High-Frequency Adaptability: Low circuit loss characteristics ensure stable signal output under long-term microwave frequency operation
Excellent Dielectric Uniformity: Provides more consistent Dk parameters than ordinary non-woven fiberglass reinforced laminates, ensuring batch product consistency
Perfect for Sensitive Circuits: Stable electrical parameters and low interference properties make it highly suitable for error-sensitive precision RF circuits
Key PCB Construction Specifications
| Parameter Item | Specific Specification |
| Base Material | Rogers CuClad 250 cross-plied woven fiberglass PTFE laminate |
| Layer Count | 2 layers (rigid structure) |
| Board Dimensions | 48.6mm × 76.9mm (±0.15mm tolerance, 1 piece) |
| Minimum Trace/Space | 4/6 mils, supporting ultra-fine precision microwave circuit design |
| Minimum Hole Size | 0.3mm for compact component layout |
| Via Design | No blind vias, pure through-hole via structure for enhanced structural stability |
| Finished Board Thickness | 0.4mm, balancing structural rigidity and device integration flexibility |
| Finished Copper Weight | 1oz (1.4 mils) outer copper layers for stable current conduction and signal transmission |
| Via Plating Thickness | 20μm, ensuring reliable via conductivity and long-term oxidation resistance |
| Surface Finish | Immersion Gold, optimizing component soldering quality and surface durability |
| Silkscreen | White top silkscreen, no bottom silkscreen for clear component marking |
| Solder Mask | Blue top solder mask, no bottom solder mask |
| Quality Test Standard | 100% full electrical testing implemented prior to shipment to eliminate open and short circuit risks |
2-Layer Rogers CuClad 250 PCB Stack-up Structure
This professional 2-layer rigid stack-up adopts standardized Rogers CuClad 250 core material, featuring balanced cross-plied structural stress and uniform dielectric performance, perfectly matching high-frequency microwave circuit operating requirements:
| Layer Sequence | Material Specification | Thickness | Core Function |
| Outer Layer 1 (Top) | Conductive Copper Foil | 35μm | High-frequency microwave signal transmission and component soldering carrier |
| Core Dielectric Layer | Rogers CuClad 250 composite core substrate | 0.254mm (10mil) | Balanced low-loss dielectric isolation, stable Dk uniformity for microwave circuits |
| Outer Layer 2 (Bottom) | Conductive Copper Foil | 35μm | Auxiliary circuit transmission and overall structural balance support |
PCB Circuit & Component Statistics
| Parameter Item | Specific Value |
| Components | 12 |
| Total Pads | 34 |
| Thru Hole Pads | 18 |
| Top SMT Pads | 16 |
| Bottom SMT Pads | 0 |
| Vias | 9 |
| Nets | 2 |
Accepted Artwork Format: We accept standard Gerber RS-274-X design files submitted by global customers. This universal industry-standard format supports accurate technical evaluation, professional custom quotation, and precise mass production, enabling efficient and error-free project collaboration for all international PCB customization orders.
Production Quality Standard: All Rogers CuClad 250 high-frequency PCBs are manufactured and inspected in strict compliance with IPC-Class-2 industrial reliability standards. Comprehensive standardized production and quality inspection workflows ensure outstanding dimensional accuracy and stable electrical performance for every finished unit.
Global Supply Service: We deliver reliable worldwide PCB quotation and international shipping services. Global clients can submit Gerber files for exclusive custom quotes, and we provide complete one-stop solutions covering PCB quotation, precision manufacturing, full quality testing, and global logistics delivery.
Typical Application Scenarios
Thanks to its low dielectric loss, balanced mechanical stability, and excellent parameter uniformity, Rogers CuClad 250 2-layer PCBs are widely deployed in high-precision microwave and RF industrial systems:
Precision Radar Systems: Military and civil radar equipment, electronic countermeasure (ECM) and electronic support measure (ESM) devices
Microwave Components: Low-noise amplifiers (LNAs), microwave filters, power couplers, and other core microwave functional modules
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10mil Rogers CuClad 250 PCB Immersion Gold Finish Low-Dk Images
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