We are pleased to introduce our newly shipped PCB utilizing RT/duroid 5880 material, specifically designed for high-frequency and broadband applications. Rogers RT/duroid 5880 laminates are PTFE composites reinforced with glass microfibers, offering a low dielectric constant (Dk) and low dielectric loss. The randomly oriented microfibers help maintain uniformity in the dielectric constant, making this material ideal for demanding RF environments.
Key Features
- Dielectric Constant: 2.2 with a tight tolerance of ±0.02 at 10 GHz/23°C
- Dissipation Factor: 0.0009 at 10 GHz
- Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C
- Moisture Absorption: Low at 0.02%
- CTE (Coefficient of Thermal Expansion):
- X-axis: 31 ppm/°C
- Y-axis: 48 ppm/°C
- Z-axis: 237 ppm/°C
- Isotropic Properties: Ensures consistent performance in all directions
Benefits
- Uniform Electrical Properties: Maintains consistent performance over a wide frequency range.
- Machinability: Easily cut, shaped, and machined to fit specific design needs.
- Chemical Resistance: Resists solvents and reagents commonly used in etching and plating processes.
- Moisture Resistance: Suitable for high-moisture environments, ensuring reliability.
- Established Material: A well-recognized choice for high-frequency applications.
- Low Electrical Loss: Provides the lowest loss characteristics among reinforced PTFE materials.
| RT/duroid 5880 Typical Value |
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 2.20
2.20±0.02 spec. | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0004
0.0009 | Z | N/A | C24/23/50
C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 |
| Specific Heat | 0.96(0.23) | N/A | j/g/k
(cal/g/c) | N/A | Calculated |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X |
| 860(125) | 380(55) | Y |
| Ultimate Stress | 29(4.2) | 20(2.9) | X |
| 27(3.9) | 18(2.6) | Y |
| Ultimate Strain | 6 | 7.2 | X | % |
| 4.9 | 5.8 | Y |
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y |
| 940(136) | 670(97) | Z |
| Ultimate Stress | 27(3.9) | 22(3.2) | X |
| 29(5.3) | 21(3.1) | Y |
| 52(7.5) | 43(6.3) | Z |
| Ultimate Strain | 8.5 | 8.4 | X | % |
| 7.7 | 7.8 | Y |
| 12.5 | 17.6 | Z |
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 |
| Coefficient of Thermal Expansion | 31
48
237 | X
Y
Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil
after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A |
PCB Stackup
- Copper Layer 1: 35 μm
- RT/duroid 5880 Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
- RO4450F Prepreg Bondply: 0.101 mm (4 mil)
- RT/duroid 5880 Core: 0.787 mm (31 mil)
- Copper Layer 3: 35 μm
Construction Details
The PCB dimensions are 274.32 mm x 179.65 mm (± 0.15 mm) with a finished thickness of 1.2 mm. It supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.4 mm. The finished copper weight is 1 oz (1.4 mils) for both inner and outer layers, with a via plating thickness of 20 μm. The surface finish is immersion tin, with no silkscreen or solder masks applied to either side. Each board undergoes 100% electrical testing before shipment to ensure quality.
Compliance and Availability
The RT/duroid 5880 PCB is designed to meet stringent industry standards, featuring artwork in the Gerber RS-274-X format. It adheres to the IPC-Class-2 quality standard, ensuring reliability and performance in various applications. This product is available for worldwide distribution, making it accessible to customers globally.
Typical Applications
- Commercial airline broadband antennas
- Microstrip and stripline circuits
- Millimeter wave applications
- Radar systems
- Guidance systems
- Point-to-point digital radio antennas
Utilize the exceptional properties of the RT/duroid 5880 PCB to enhance performance and reliability in your high-frequency applications, ensuring dependable operation in challenging environments.
Product Tags:
|
|
1.2mm RT / Duroid 5880 PCB 3-Layer Immersion Tin Circuit Board Images
|
