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60mil RO3003 PCB Double-sided Immersion Gold Circuits

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60mil RO3003 PCB Double-sided Immersion Gold Circuits

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Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : RO3003

PCB size : 63mm x 35 mm=1PCS

Copper weight : 1oz (1.4 mils)

Surface finish : Immersion gold

Layer count : 2-layer

PCB Thickness : 1.6mm

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Introduction:
The Rogers RO3003 PCB is a state-of-the-art, ceramic-filled PTFE composite designed for commercial microwave and RF applications. This advanced laminate offers unparalleled stability of the dielectric constant (Dk) across a wide range of temperatures and frequencies, making it the perfect choice for cutting-edge technologies like automotive radar, 5G wireless infrastructure, and advanced driver assistance systems (ADAS).

Key Features:

Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal stability with Td > 500°C
Excellent mechanical properties with CTE matching copper
Low moisture absorption of just 0.04%
Economical volume manufacturing process

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Benefits:

Reliable performance up to 77 GHz for applications like automotive radar
Stable dielectric constant ideal for filters, antennas, and oscillators
Dimensional stability for robust surface mount assembly
Suitable for hybrid multilayer designs with a range of dielectric constants
Cost-effective solution for high-volume production

PCB Specifications:

2-layer rigid PCB construction
60 mil (1.524 mm) Rogers RO3003 substrate
35 μm copper layers
Minimum trace/space of 4/6 mils
Finished board thickness of 1.6 mm
1 oz (1.4 mils) outer layer copper weight
Immersion gold surface finish

60mil RO3003 PCB Double-sided Immersion Gold Circuits

Applications:
The Rogers RO3003 PCB is the ideal choice for a wide range of high-frequency applications, including:

Automotive radar
Global positioning satellite antennas
Cellular telecommunications systems
Wireless communication patch antennas
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes

60mil RO3003 PCB Double-sided Immersion Gold Circuits


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Wholesale 60mil RO3003 PCB Double-sided Immersion Gold Circuits from china suppliers

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