TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material

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TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material

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TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material

Material Introduction TSM-DS3 is an exceptional thermally stable material that boasts industry-leading low loss properties with a dissipation factor (DF) of 0.0011 at 10 GHz. It offers the predictabil...

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5mil High Frequency Printed Circuit Board

Ceramic Filled Reinforced Material PCB Board

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