TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

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City: Shenzhen

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TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

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TC350 RF PCB Based On 20mil Substrate With Immersion Tin For Power Amplifier

Today, we are happy to share our newly shipped PCB with you. A cutting-edge solution supplied to meet the demanding requirements of high-performance applications. With its woven fiberglass reinforced, ...

Product Tags:

20mil PCB Substrate

Power Amplifier PCB Materials

Immersion Tin RF PCB Board

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